SemiCon

Forging Productivity with Waterjet

In the semiconductor wafer fabrication process, deposition methods such as PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), ECD (Electrochemical Deposition), ALD (Atomic Layer Deposition) are utilized to build-up different materials, like tungsten, titanium, and copper, onto the wafer.

Within the process chamber where these processes take place, the components that hold the wafer during fabrication (shields, collimators, and clamping rings, for example), experience product build-up. These deposits need to be removed from the process chamber components during the refurbishment process.