SemiCon

Forging Productivity with Waterjet

In the semiconductor wafer fabrication process, several different types of deposition methods are utilized to build-up different materials, like tungsten, titanium, and copper, onto the wafer.

These deposition processes include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), atomic layer deposition (ALD), among others. Within the chamber where these processes take place, the components that hold the wafer during fabrication (shields, collimators, and disks, for example), experience product build-up. These deposits need to be removed from the fabrication equipment during the component refurbishment process.

Ultrahigh Pressure Waterjet Stripping

The Aquarese WJS coating removal system enables reliable and cost-effective removal of these deposits. Ultrahigh-waterjet blasting is a preferred method for removing tough coatings with ease.

Waterjet Stripping for SemiCon

Benefits

Reliable

Precise

Cost Effective

Aquarese is proud to be a Shape Technologies Group company, partnering with the world leaders in UHP technology to engineer and deliver the future of manufacturing process solutions.